Smart Multilayered Ceramics

Core Design Conce
Integrating FR4 embedding technologies with varying materials, including ceramics
Key Features & Benefits
  • Ceramic & FR4 composite boards
  • Breakdown voltage ≥15KV
  • Best suited for outdoor & high humidity environment
  • UL:E173761

Copper thickness normally 2oz;
4-layer structure: L2 & L3 are dummy layers for resin fillings;
Minimum space between AIN is 3mm

Easy machinability: screw mounting, routing

  • Patented multi-layered FR4 with ceram icinsert enables
  • Unique cost benefit of FR4 coupled with thermal and electrical performance of ceramics
  • Aluminum nitride (170W/mK) for high power spot heat extraction

For Simplifying Complicity

MHE@901 Solution

Thermal Performance

Assumption & Boundary Conditions

  • Bysymmetry,only1⁄4ofthe3Dmodelisconsidered
  • Isotropic material properties
  • SSteady state
  • Loading: 10W (thermal chip); 50W/m²℃, 25m²℃ T

Copper Thermal vias MHE

MHE®901 (Ceramic Inlay)

FR4 (Cu Thermal Vias)

HEAT IS MORE UNIFORM SPREAD in MHE® 901

HEAT IS

MORE UNIFORM SPREAD in

MHE® 901

Datasheet MHE

Reliability Testing for Outdoor, Stage, Automotive