Smart Multilayered Ceramics
Copper thickness normally 2oz;
4-layer structure: L2 & L3 are dummy layers for resin fillings;
Minimum space between AIN is 3mm
Easy machinability: screw mounting, routing
For Simplifying Complicity
MHE@901 Solution
Thermal Performance
Assumption & Boundary Conditions
Copper Thermal vias MHE
MHE®901 (Ceramic Inlay)
FR4 (Cu Thermal Vias)
HEAT IS MORE UNIFORM SPREAD in MHE® 901
HEAT IS
MORE UNIFORM SPREAD in
MHE® 901
Datasheet MHE
Reliability Testing for Outdoor, Stage, Automotive